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OptoSys - Optische Verbindungssysteme

In the project "Massively Parallel Optical Onboard and Intrasystem Interconnections for High-Performance Computers", which is part of the BMBF-funded research program "OptoSys" (Optical Interconnection Systems), deals with the hot embossing-based manufacture of optical waveguides for integration in electrical printed circuit boards. 
Particularly difficult demands on manufacturing technology result from the high level of parallelism of optical interconnections, which must operate with sufficiently low attenuation. This technological part of the project benefits from cooperation with ILFA Feinstleitertechnik GmbH in Hannover, Infineon Technologies AG in Berlin and the University of Dortmund. The main results of this research are a hot embossing technology for producing low-loss, parallel waveguides with integrated micromirrors for beam deflection and coupling, a technology to integrate waveguides in conventional electrical printed circuit boards, and a concept to couple transmitter and receiver modules to board-integrated waveguides. This coupling concept uses the waveguides' micromirrors, and supports surface mounting of converter modules in the standardized printed circuit board assembly process. Another objective of the project is the extension of the design process for electrical-optical printed circuit boards for computer application. One goal of the work is to develop simulation algorithms for time domain analyses of optical multimode waveguides in order to optimize optical interconnections during the design process. The modeling and simulation approaches are based on geometrical optics (ray tracing methods) and therefore require a very accurate geometrical description of the waveguides. To this end, C-LAB developed a description method based on cubic splines that supports accurate, analytical and convenient representation of waveguide surfaces and is suitable for ray tracing analysis of the waveguides. A further objective is the development of simulation models of laser- and photo diodes. These models have to be compatible to the ray tracing analysis approach of the optical waveguides.

Project funded by: BMBF
Project duration: 04/1998 - 03/2002
Project partners: Siemens SBS C-LAB (D), Universität Paderborn (D), Universität Dortmund (D), ILFA Feinstleitertechnik GmbH (D), Infineon Technologies AG (D), DaimlerChrysler AG (D), Universität Ulm (D), Fraunhofer-Institut für Angewandte Festkörperphysik Freiburg (D)
Contact: Dr. Jürgen Schrage, C-LAB