Industrial Production Technologies for Printed Circuit Boards with Integrated, Optical Short-Distance Interconnections The objective of the "OptiCon" project is to develop inexpensive design and manufacturing methods for broad industrial application of innovative, electrical-optical interconnection technology on printed circuit boards. A prime requirement, for reasons of cost, is compatibility with existing conventional design and production processes. The solutions that have been developed in the course of the project are targeted initially at telecommunication applications with high bandwidth requirements (in excess of 2.5 Gbits/s per single interconnection), but other fields of application can also be addressed because the approaches have been kept as general as possible.
Basis of the project work are the results of the nearly finished R&D projects OptoSys, EOCB und MOES, which are further developed in order to obtain solutions that can be exploited by industry. The work concentrates on the key phases of design and production in the overall product realization process chain.
Project funded by: BMBF
Project duration: 01/2001 - 06/2004
Project partners: Siemens AG ICN (D), Siemens AG CT (D), Siemens SBS C-LAB (D), Alcatel SEL AG (D), Harting KGaA (D), W.L. Gore & Associates GmbH (D), ILFA Feinstleitertechnik GmbH (D), Universität Paderborn (D), Universität Dortmund (D)
Contact: Dr. Jürgen Schrage, C-LAB
Dr. Peter Demmer, Siemens AG CT, Projectmanager